Uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard, apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC and cause IC damage, pure copper heat conduction block does not directly contact the main board
PCB repair platform added CPU positioning structure. No manual positioning needed, improve the success rate.
PCB repair platform designed with integrated layer tin planting function. The precision stencils are produced by world's leading laser technology.